PhotonicPlug: Scalable Optical Packaging

Passive assembly of dense fiber-array to chip

 
 
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±20 micron assembly tOLERANCEs

Unprecedented placement tolerances of ±20µm allows assembly of single-mode fiber array to optical chip by standard and high throughput flip-chip machines

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wide band surface coupling geometry

Replacement of Edge-coupling by Surface-coupling geometry with wafer level implementation of Teramount’s Wide Band PhotonicBump on optical chip

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Pluggable PhotonicPlug for co-packaged platform

Pluggable PhotonicPlug for co-packaged platform connectivity with fiber high density and large port count