About us

Teramount changes the world of optical connectivity by offering a novel solution, the patent-pending Photonic-Plug, for connecting optics to silicon.

Teramount Photonic-Plug enables standard semiconductor manufacturing processes and packaging flow in silicon photonics, thus enables any fabless semiconductor company to expand into silicon photonics while working with traditional foundries and OSATs.

Most existing solutions for silicon photonics packaging are based on active alignment processes, which require non-standard and expensive equipment. Teramount's Photonic-Plug offers high assembly tolerances that allow for passive alignment processes and enables high volume packaging through standard CMOS assembly lines, thus improving throughput and lowering cost.

By solving the most difficult challenge in the proliferation of silicon photonics, the connection of optics to silicon, Teramount enables broad deployment of Transceiver and co-packaged Switch connectivity in data  centers and other datacom and telecom applications.  


PhotonicPlug: Scalable Optical Packaging

Passive assembly of dense fiber-array to chip

Passive fiber assembly tolerance.PNG

±20 micron assembly tOLERANCEs

Unprecedented placement tolerances of ±20µm allows assembly of single-mode fiber array to optical chip by standard and high throughput flip-chip machines

wide band surface coupling silicon photonics.PNG

wide band surface coupling geometry

Replacement of Edge-coupling by Surface-coupling geometry with wafer level implementation of Teramount’s Wide Band PhotonicBump on optical chip

Co package switch.png

Pluggable PhotonicPlug for co-packaged platform

Pluggable PhotonicPlug for co-packaged platform connectivity with fiber high density and large port count

Teramount team is highly experienced in silicon fabrication processes, photonic devices and stat of the are photonic coupling solutions. 

Hesham Taha, Ph.D.   CEO and co-founder

Avi Israel, Ph.D. CTO and co-founder

Raanan Gewirtzman, Chairman: Former CEO of BroadLight

Advisory Board Members:

David (Dadi) Perlmutter: Former Executive VP at Intel and Director at Mellanox Technologies

Danny Biran: Former Senior VP at Altera 

Gil Frostig: Former VP at Intel and and Qualcomm

Teramount Ltd.

Hi-tech village, Building 4.5
Givaat Ram, POB 39132
Jerusalem, 9139102



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